1, material material: LinBo3 LT 
 2, specification size: ± Φ100 ± 
 Wafer thickness: ±-5mm 
 3, Quality Mass: 20/10 face surface of the highest> 1 / 4 45 degree bevel edge without chipping down the bubble-free X, Y, Z axis ± 
 4, chip optical properties: 
 (1) :370-5000nm wavelength light 
 (2), refractive index: (633nm) no = ne = 
 (3), the refractive index gradient (633nm) ≤ 5 × 10-5/cm 
 (4), light transmittance (633nm) ≥ 68% 
 (5), the birefringence: △ n = no - ne ≈ 
 5 per month Month output: 5 万 PCS